​Modified Polyamide hot melt adhesive series are polyamide hot melt adhesive resin modified by Polycondensation. It has good heat/cold/oil resistance, it is odorless, flexibile, fast curing and etc. It has good adhesion with metal or nonmetal material and has been widely used in electronics, shoe, automobile filter, heat-shrink tube and so on. It is a new type of high performance polyamide hot melt adhesive. 

Technical Data

 

Series
Type
Form
Melting Range DSC (℃)
Melting Flow Index g/10 min, 160℃
Press Condition
Time (S)
Temp (℃)
Press (kgf/㎡)
PA Material 2080 P,G 80-90 45-75 15 100 2


Series
Type
Form
Melting Range DSC (℃)
Viscosity (210℃ Pa。S)
PA Material 2120 G 110-125 3000-5000


Series
Type
Form
Softening Point (℃)
Viscosity (210℃ Pa.S)
PA Material 2170 G 145-155 3000-7000
2171 G 155-165 3000-7000
2173 G 185 3000-7000
2175 G 195 2000-8000
2120 G 110 3000-5000


Remark

1.Product technical data is based on typical product, it does not represent our guarantee to this product. Please consult us for specific product data. 
2.Specification: 0-80um is used for starch producing of heat transfer, flocking and gliding. 0-120, 0-160, 0-170um for powder dot process. 80-170 and 80-200um for double dot process for interlining. 5-200, 150-250 and 180-420um for powder scattering process. We can make different particle size for customized requirements. 
3.Form: P: powder G: granule

Application

   

X
甘肃快3 甘肃快3 新浪彩票 新浪彩票 甘肃快三 江苏福彩 江苏福彩 江苏福彩 江苏福彩 江苏福彩