EVA cell encapsulating film is thermosetting, it takes EVA resin as base material and add with various modifiers, it is prepared by melt extrusion。 It has UV resistance, anti-aging/yellowing and high peeling strength。 It is mainly used in cell module encapsulating to ensure the long-term, stable and efficient use of the cell module。


SHANGHAI TIANYANG cooperates with East China University of Technologyhas to successfully develope JCC-105 EVA film for cell module encapsulating. We have certification for SGS, UL and TUV. SHANGHAI TIANYANG is in the domestic leading level for its peeling strength, shrinkage, transmittance, crosslinking degree, anti-aging and other aspects of similar products.


JCC-105W white EVA film for single glass module is sutable for single/polycrystalline module. It solves the common problems in production, such as white layer, cell overlapping, shifting or bubbling. It can effectively improve module power and reduce cell to module loss (CTM).


JCC-105W Performance Parameter

Performance
Unit
White Film JCC-105W
Tensile Strength Mpa >25
Elongation at Break % 500
Peeling Strength from Film to Glass (140℃, 15min after curing) N/cm >70
Peeling Strength from Film to Board (140℃, 15min after curing) N/cm >60
Volume Resistivity Ω•cm >1×1014
Shrinkage (test before curing, 120℃, 5min) % MD<3。5
TD <1.0
Reflectivity (400~700nm) % >90
Complete Crosslinking Degree (140℃, 15min) % >75.0
UV/Aging Resistance (UV, 1000hr) ΔYI ≤2
DH1000 (+85℃, humidity 85%, 1000hr) ΔYI ≤3


JCC-105P is UV-cut EVA film, JCC-105P-T is high transparant EVA film. All series of EVA film has upgraded to anti-PID type, which can effectively reduce module power attenuation and reduce PID risk. Excellent resistance for weathering, high temperature and humidity, UV, etc. Excellent material compatibility, good adhesion to glass, metal, back plate, etc.

JCC-105P Performance Parameter

Performance
Unit
Hi-cut JCC-105P
Hi-transparant JCC-105P-T
Tensile Strength Mpa 20 20
Elongation at Break % 500 500
Peeling Strength from Film to Glass (140℃, 15min after curing) N/cm >80 >80
Peeling Strength from Film to back plate (140℃, 15min after curing) N/cm >60 >60
Transmittance (after curing) 280-380nm % ≤20.0 ≤80
238-800nm % ≤91.5 ≤91.5
Volume Resistance Ω•cm ≥1×1015 ≥1×1015
Shrinkage (test before curing, 120℃, 5min) % MD<3.0 MD<3.0
TD<1。0 TD<1。0
Complete Crosslinking Degree (140℃, 15min) % >75.0 >75.0
UV/Aging Resistance (UV, 1000hr) ΔYI ≤3 ≤3
DH1000 (+85℃, humidity 85%, 1000hr) ΔYI ≤3 ≤3


JCC-205 has better resistance for aging, water and PID than EVA does。 It is especially suitable for matching-P type PERC cell and is widely used in double-sided/glass modules。

Product Features:

1. Excellent water vapor barrier performance; 

2。 Crosslinking type, crosslinking rate > 75%; 

3。 High transmittance, low fog; 

4。 Non corrosive gas release; 

5。 Excellent long term PID resistance; 

6。 Good wet/heat and UV resistance。


JCC-205Performance Parameter

Performance
Unit
Test Method
JCC-205
JCC-205T
Thickness mm JCC method 0.4-0.8 0。4-0。8
Density (after crosslinking) g/cm³ ASTM D792 0.85 0。85
Peeling Strength from Film to back plate N/cm ASTM D903 >60 >60
Peeling Strength from Film to back plate N/cm ASTM D903 >100 >100
Tensile Strength (after crosslinking) Mpa GB/T13022-91 ≥16 ≥16
Elongation at Break % GB/T13022-91 ≥500 ≥500
Transmittance 280-380nm % GB/T2410-2008 >91  
380-1100nm % GB/T2410-2008 >75 >91
Crosslinking Degree  Gel% ASTM D2765 MD≦3.5 >75
Shrinkage (120℃, 5min) % ASTM D1204 TD≦2.0 MD≦3.5
TD≦2。0
Volume Resistance Ω•cm ASTM D257 >1*1016 >1*1016
UV/Aging Resistance   ΔYI GB/T 29848 <3.0 <3.0
Wet/heat/aging perfomance ΔYI GB/T 29848 <3.0 <3.0


JCC-205Using Method

This product is designed for double glass module and lamination data are as follows: Lamination temperature: 145-160 ℃, vacuum time: 5-8 min; lamination time: 12-17 min. (Customers can adjust to appropriate lamination parameters according to different equipment or process. It is recommended to use it up within 24 hours after opening).

Application

   

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